Semiconductor IC Chip Testing Lab Services
Semiconductor IC Chip Testing lab
Our semiconductor IC chip testing and product reliability lab in Bangalore, India offers services in electrical test characterization, device functionality, solid state device physics and bench probe testing for RF CMOS, MMIC, MOSFET's, LED's, power modules and more.
Semiconductor IC chip testing product reliability lab
Semiconductor IC Chip & Electronic Product Reliability Services
- Electronics testing lab failure analysis services for semiconductor IC chip MOSFET's, CMOS, Power modules, Analog devices and LED's.
- Electron Microscopy Services for product inspection.
- IC Chip Decapsulation & product reliability services.
- IC Chip Delayering and IC cross section services
- Electronic materials products reverse engineering.
- Electronic consumer product 3D X-ray microscope inspection services for PCB and 3D videos.
- Semiconductor device functionality and parameter tests.
Electronic Product Reliability and Teardown Services
- Electronic product reliability using 3D CT X-Ray microscope visual inspection.
- SMT Component dismount and de-soldering.
- IC Decapsulation.
- DIE Layout Inspection.
- FIB-TEM Die de-layering studies.
Semiconductor IC Chip Device Functionality Testing Services
DC Test Bench Probe Station
Device Functionality Testing :
- Device functionality testing and Logic verification testing to ensure IC’s logical operations match the design specifications.
- Timing analysis testing to verify that all signals propagate within the specified time limits.
- Performance testing for operational efficiency and speed of the IC.
- Semiconductor IC Chip tests using DC probe stations includes microscope/video system, vibration isolation table, probe card holders, RF and SMU DC probes. needles calibration software and standards.
- Measurements of IV, Id-Vd, Id-Vg, Break down, Carrier Recombination, Reliability life time, Pulsed Id-Vd.
- Test and pad structure design to extract Threshold Voltages, Body effect, Transconductance, Channel doping simulation.
- Specs : -100 V to +100 V
- Sweeps: -100 mA to +100 mA
- Resolution : 10 fAmps,0.05 uVolts.
- Pulse : Max 10V, 10mA.
- Temperature : 20C to 200C.
Passive Component and ParametricTesting
- Our semiconductor IC chip lab testing solutions for CV Impedance Dissipation factor on passive components.
- Product reliability voltage levels and current draw testing for semiconductor IC chip functional testing.
- Resistance and capacitance measurements to ensure component values are within specified ranges.
- Mobile ion studies, SiOx and SiNx layer integrity.
- Determine breakdown voltages and IV's.
- Measurement of resistance,Capacitance, Carrier Recombination, Metal Insulator Metal profiles.
- AC Frequency : 40 Hz to 110 MHz.
- DC Voltage : +/- 40 V.
- AC Amplitude : 5 mV to 1 V.
- CV Frequency : 1 KHz to 5 MHz.
RF CMOS, MMIC, RF Antenna and Analog testing
- Our semiconductor IC chip lab equipped with RF probe stations for the research of advanced active and passive components. Stage comes with zoom microscope with 20X and 50X magnification, LED ring Illuminator, precision x-y stage with RF probe tips.
- Device functionality testing to determine Time - Domain - Gating mode, Pulsed RF, Return Loss, Impedance, Insertion Loss.
- Measurement and failure analysis Transmission Coefficient.
- Frequency conversion, S-Parameter, Antenna, Smith chart and signal integrity measurements.
- Frequency Range : 9 kHz to 70 GHz
- Impedance : 50 ohm or 75 ohm.
- Loss Parameter : 94 dB with 0.006 dB trace noise.
Solid State Device Physics and Product Reliability Testing
Reliability testing for Solar PV Modules
- Determine Isc, Jsc, Short Circuit Current Isc, Sun Voc, Open Circuit Voltage Voc slope, Shunt resistance.
- Measurement and result analysis of Maximum Power Pmax ( Vmax and Imax), FF, Fill Factor conversion efficiency, IQE, EQE, n-efficiency conversion and spectral response.
- Sample Size : 100m to 156 mm Si and pseudo squares.
- Bias Voltage : 0 to 200 V
- Current Resolution : 10 picoampere to 10 microampere.
Product reliability on PCB and IC Failure Analysis
- Our product reliability lab is housed with C-SAM Scanning Acoustic Microscope failure analysis on PCB for Interfacial delamination, Inter connects Joint, bonding, aseal analysis and Void detection.
- Our semiconductor IC chip lab offers testing on RF CMOS, MMIC, SOC's, device functionality, device physics and bench probe testing, PCB Printed circuit board anomalies, encapsulated IC packages, PCB reverse engineering, wafer bonding, PCB lamination, Ceramic packaging encapsulants, Interconnect via metal layers and Medical devices.
- Defect Resolution : 5 micron with 0.001mm length resolution.
- Transducers Range : 50, Mhz, 100 MHz, 150 MHz and 230 MHz.
Hall Mobility, Low temperature SQUID
- Device functionality testing of Hall Voltage, Carrier Concentration, Coefficient and Carrier mobility fabrication and characterization.
- 4 probe room and low temperature sheet resistance, Vacuum, Pulse IV, CV measurement.
- Low Temperature Liquid N2 and He Superconducting pulse measurement and analysis.
- Probe Bench : 5 Probes DC Supply.
- Probe Size :10 um to 3 um.
- Liquid N2 : 77 Kelvin to 400 Kelvin.
- Liquid He : 5 Kelvin to 500 Kelvin
- Magnet : +/- 2.5 Tesla
- Vacuum Pressure : 4.5 e-07 mBar.