Welcome to Nanowatts Electronics Testing Lab
Electronics Testing lab : Unlock the Root Cause
Our electrical and electronics testing lab located in Bangalore India for electronic materials testing IC's, PCB Testing, MOSFET, LED's, Power Modules, Transistors, Diodes, Capacitors, Resistors, for enhanced failure analysis studies.
Electrical & Electronics Testing and Inspection Services
Printed Circuit Board PCB Testing
- Electrical and Electronics Testing Lab located in Bangalore, India uses X-ray inspection tools is used to detect hidden defects such as voids, solder joint integrity, and internal components that are not visible to the naked eye. This is particularly crucial for complex PCBs with high-density interconnections and multilayer designs, ensuring the integrity of solder joints and connections beneath components such as Ball Grid Arrays.
Thermal Imaging and Profiling :
- Failure analysis evaluation of the heat stability, heat resistance, and heat expansion properties of materials used in PCBs to ensure that they can withstand the heat generated during device operation and manufacturing.
Delamination and Voids in Semiconductor Packages :
- C SAM is used to examine flip-chips, ball grid arrays (BGAs), and other electronic materials technologies. By providing high-resolution acoustic images, CSAM allows for the detection of internal structural defects that can be detrimental to the reliability and performance of semiconductor devices. This ensures the integrity and longevity of the packages before they are assembled into electronic products.
Electronic Materials Analysis
Thermal Analysis :
- Electronic Materials analysis of heat stability, heat resistance, and thermal expansion properties of materials used in PCBs, Diodes, LED's, Power modules, ensuring they can withstand the heat generated during device operation and manufacturing processes.
Mechanical Integrity :
- Mechanical failure analysis tensile strength, compressive strength, flexural strength, and hardness of materials to ensure they can endure mechanical stresses during assembly and use, preventing failures due to physical damage.
Environmental and Reliability Testing :
- Providing materials with temperature cycling, humidity exposure and corrosive environments to simulate real-world conditions, ensuring they can maintain performance and integrity over time in various applications.
Electrical & Electronic Component Analysis Lab
Component Material Testing
- Inspection of MOSFET, IC's surface structures at the microscopic scale.
- Electronic materials microstructure investigation through sample cut, mount polishing metallographic analysis.
- Measuring layer thickness of component pins and circuit board inner layers.
- Identifying and evaluating solder joints, plated through holes, plating thickness and bonding areas.
- Identifying failure analysis mechanisms in electronic components.
- Detecting fractures and other types of damage.
- Identifying printed circuit board delamination.
- Conducting aging processes in electronic materials.
- Analysis of contact surfaces of press-fit pins in plated through holes.
- Performing solder joint investigation.
Electron Microscopy Inspection
Detection of Failure spots :
- Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) are used in electrical and electronics testing labs to detect and analyze microcracks and fractures in electronic components such as integrated circuits (ICs), printed circuit boards (PCBs), MOSFET, IC's, Power modules, and solder joints.
Identification of Contamination and Foreign Particles :
- Contamination and foreign particles can lead to short circuits, corrosion, and other reliability issues in electronic components. Microscopy techniques, such as Energy Dispersive X-ray Spectroscopy (EDS) coupled with SEM, enable the identification and elemental analysis of contaminants, facilitating the development of cleaner manufacturing processes and improved product reliability
Examination of Intermetallic Compound Formation :
- Failure analysis of Intermetallic compounds (IMCs) form at the interface of solder and substrate materials, affecting the mechanical strength and reliability of solder joints. TEM and focused ion beam (FIB) microscopy are used to study the formation and growth of IMCs, allowing engineers to understand their impact on component performance and implement strategies to control IMC formation.
Consumer Electronics Failure Analysis Services
Transistors, Diodes, Capacitors, Resistors:
Electrical and Electronics Testing Lab in Bangalore India work on transistors, diodes, capacitors, and resistors to identify issues such as metallization defects, dielectric breakdown, and material fatigue. Microscopy and spectroscopy testing services provide insights into component degradation mechanisms, enabling improvements in design, materials selection, and manufacturing.
IC's, MOSFET, IGBT:
Failure analysis of IC's, MOSFET involves techniques like SEM (Scanning Electron Microscopy), TEM (Transmission Electron Microscopy), and FIB (Focused Ion Beam) microscopy to investigate defects such as gate oxide failures, metal interconnect issues, and semiconductor die cracks. Detailed analysis helps determine the root cause of IC failures, whether due to design flaws, manufacturing defects, or environmental factors.
LEDs and Power Modules :
LEDs and Power modules are critical components in electronic systems, subject to high electrical currents and thermal stresses. Failure analysis techniques such as thermal imaging, SEM/EDS (Energy Dispersive X-ray Spectroscopy), and electrical testing are employed to investigate issues such as bond wire failures, junction overheating, and solder fatigue.