Micro Nanofabrication services
Nanofabrication and Foundry services
Are you looking for unique clean room nanofabrication wafer processing services for your company to iterate and test nano devices. Let us know your needs and our staff will assist you all the way. We also provide microfluidic medical device fabrication services equipped electronic packaging prototyping lab facilities.
Test your device performance
Hall Mobility Bar Fabrication
- Substrate selection and preparation.
- Metal contacts deposition and lift offs.
- E-beam and Optical lithography Hall Bars fabrication
- Dry Etch and Wet Etched Inverse Lithography.
- Hall Mobility Device Electrical Characterization.
Membrane Fabrication Services
- Substrate selection for SOI and other substrate
- Back side deep trench wet and dry etch
- Dielectric, contacts and Vias fabrication
- Active layers, Electrodes and sealing
- Membrane release and Back grinding
- Applications : Pressure Sensors, Accelerometers, Microphones, Optical Modulators, BioMed Devices, Energy harvester device
Process integration on to device substrates
Nanowire Nanorod Nanotubes
- Physical Vapor Deposition and thermal growth
- CVD Vapor Liquid Solid growth
- Sol-gel and Hydrothermal based synthesis
- Bottom-up and template based growth
- Direct nanowire process integration to substrates
- Applications : Field Emission Devices, Quantum dots, Chemical gas sensors, Energy converters, Battery, Qubit devices
Photolithography Reticles and Shadow Masks
Photo Mask Making Services
- Mask layout engineering, Synthesis and Verification.
- LRC VRC CCRC checksum and correction for GDS II foundry mask file conversion.
- Mask design support with in house CAD software's.
- Direct Laser writer services.
- Scribe channel, manufacturing structures design.
- Full device solutions with prototyping services.
Prototype development
- Substrate Process Integration : Silicon, Silicon on Insulator, Quartz, Glass, GaAs, InGaP, GaN, AlGaN, PDMS, PMMA, 156x mm 125x mm solar pseudo squares, Polymer and Flexible cleanroom compatible substrates.
- Inkjet Metal contact printing, Nanowires, Nanotubes and Graphene prototype and process support.
- Bio-Sensors, Nanoneedles, PDMS, PMMA assay chips, Nano and Microfluidics devices, lab on chip fabrication.
- Opto Electronics and Nano Photonics. Gratings and optical waveguide on SOI and Si fabrication and integration.
- RF CMOS - MMIC Phase shifters, Filters, Oscillator, Circuit switch, Inductor, Varactor design and RF Antenna design & process integration.
- CMOS, Metal Insulators MIM, Passives, Diodes, Ring oscillators, Interconnect and TFT and EAD Tags proof of concept design and fabrication.
Build MVP's
Are you looking for flexible clean room nanofabrication wafer processing services for your company to iterate proof of concept MVP's. We're all ears. We apply strict NDA.
Nanofabrication Wafer Processing Services
Circuit Design, Verification, Mask Design and Mask Making.
- Mask layout engineering, Synthesis and Verification.
- Lrc Vrc Crc checksum and correction for GDS II foundry mask file conversion.
- Layout design for 4-point probe structure and van der paum test structures to extract Sheet resistance, Contact chain, Contact resistance. Continuity and channel Isolation.
- Channel design, ring oscillators, amp circuit and stringers on Dual well CMOS TFT EAD tags design.
- Test and pad structure design to extract Threshold Voltages, Transconductance, Body effect, Channel doping simulation.
- Channel mobility extraction, Channel length modulation, Break down structures.
- GDS II GLOBALMARKS pattern generation for ISO, P-WELL regions for NMOS, GATE patterns for wiring and MOS gates, N-DOPE & P-DOPE well definition, CONT active layers, and contact METAL pads for wiring and via interconnects.
Metrology and In-Line Characterization
- Spectroscopic Ellipsometry for thickness and optical properties ( n, K values) for single to multilayer thin films. Thickness 3D mapping and needed application.
- In line 20 X to 500 X digital optical and dark field microscopes.
- Metrology Atomic Force Microscopy for step height, Plasma treated surface roughness measurements.
- Profilometer Step height and 3D surface mapping.
- Optical reflectometer for Resist, Polysilicon thickness.
- 4-point Sheet resistance mapping.
- Stress tester for tensile, compressive stress analysis.
Dicing, Bonding, Polishing and Micro Electronics Packaging
- 4 to 6 inch wafer dice for Silicon, Glass, Quartz and bonded wafers, with protective resist coat.
- Chemical Mechanical Polishing (CMP) with Si and Poly Si slurry, Oxide Ultra Sol an IC PAD stiffer and topology.
- Low volume multi layer optoelectronics prototyping .
- Laser bar and diode bonding with Indium, Gold and Tin. Glueing, curing between Silicon dies and glass.
- Anodic bonding on 4 inch to pieces, with 0.5 micron accuracy alignment.
- Backgrinder and polisher to remove excess Silicon, compound semiconductor, packaging residue resin, copper posts and other compound materials.